Investigating microstructure and interfacial stability of Bi-enhanced Sn-9Zn alloy on electroplated Cu during aging

Publication Information

Title

Japanese:
English:	Investigating microstructure and interfacial stability of Bi-enhanced Sn-9Zn alloy on electroplated Cu during aging

Author

Japanese:	Chan-Ying Lin, OH Minho, 小林郁夫, Chih-Ming Chen, Yu-An Shen.
English:	Chan-Ying Lin, Minho Oh, Equo Kobayashi, Chih-Ming Chen, Yu-An Shen.

Language

English

Journal/Book name

Japanese:
English:	Materials Science in Semiconductor Processing

Volume, Number, Page

Volume 18 109046

Published date

Feb. 2025

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

Official URL

DOI