Proceedings of the 8th International Welding Symposium organized by Japan Welding Society
巻, 号, ページ
出版年月
2008年11月
出版者
和文:
英文:
Japan Welding Society
会議名称
和文:
第８回国際溶接シンポジウム
英文:
8th International Symposium
開催地
和文:
国立京都国際会館
英文:
Kyoto International Conference Center, Kyoto, Japan
アブストラクト
The down-sizing of the application specific integrated circuit (ASIC) devices requires the smaller parts for power device, e.g. micro-solenoids, micro-capacitor, etc. Such the micro-electronics parts are currently commercially obtainable but it is still difficult or insufficiently efficient to join those parts, especially the fine thread of oxygen free cupper wire (OF-Cu wire) to the sub-millimeter scale tiny electronic terminal. The conventional soldering melts the wire to cut. The ultrasonic pressure bonding is the possible candidate, but it is afraid that the deformation of the fine wire makes the joint weak. The microscopic-scale mechanical joining method is applicable to fix the micro-wire to electricity terminal. The so-we-call micro-mechanical joining consists from three processes; engraving a groove on the electric terminal, inserting the fine OF-Cu wire in the groove, swaging the groove wall by pressing a sharp wedge to fix the wire. In this research, the conditions are investigated to obtain the joint robustly using the Taguchi method.
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