Deposition of metallic electrodes on a semiconductor medium is an indispensable factor in governing carrier injection, and a metal/semiconductor contact that can be formed via solution process is highly desired in printed electronics. However, fine-patterning the solution processes of metallic electrodes without damaging the excellent electronic properties of organic semiconductors (OSCs) is still a challenge. In this work, electroless plating, a metal coating technique that involves auto-catalytic reaction in an aqueous solution, is used to fabricate top-contact organic thin-film transistors (OTFTs). An electroless-plated gold pattern with a spatial resolution of 10 micrometers is transferred and laminated on a monolayer of OSCs to serve as a hole-injection electrode. The fabricated OTFTs exhibit reasonably high field-effect mobility of up to 13 cm2 V−1 s−1 and decent contact resistance as low as 120 Ω · cm, which implies that an ideal metal/semiconductor contact can be realized. This electroless plating technique can provide possibilities for practical mass production of organic integrated circuits because it is in principle cost-effective, capable of covering large areas, high-vacuum free, and environmentally friendly.
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