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THOMSEN SILVEIRAJoao Vitor 研究業績一覧 (17件)
論文
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 13,
No. 3,
pp. 315-322,
2023.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 12,
No. 2,
pp. 280,
2022.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
H. Nakamizo,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor,
Transactions of The Japan Institute of Electronics Packaging,
Vol. 14,
pp. E21-003-1,
2021.
国際会議発表 (査読有り)
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J.V. Thomsen Silveira,
D. Higuma,
K. Fushinobu.
Thermal property estimation of thin layered structures via the pump-probe transient thermoreflectance and network identification methods,
8th TFEC (Thermal and Fluids Engineering Conference, by ASTFE),
Proc. 8th TFEC,
Mar. 2023.
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J.V. Thomsen Silveira,
D. Higuma,
K. Fushinobu.
Visualization of Thermal Networks in Layered Structures by Means of Pump-Probe and Deconvolution Technique,
PSFVIP13,
Proc. PSFVIP13,
Aug. 2022.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor,
ISTP30,
Proc. ISTP30,
No. ISTP134,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Transient thermal response investigation of multiple heat-source electronic systems,
ISTP30,
Proc. ISTP30,
No. ISTP212,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
B. Yang,
R. Yasui,
T. Shinoda,
K. Fushinobu.
Analysis of heat transfer from a heat dissipating device on a substrate,
ITherm 2019,
Proc. ITherm2019,
No. 400,
May 2019.
国内会議発表 (査読なし・不明)
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THOMSEN SILVEIRA Joao Vitor,
伏信 一慶.
A power device probe for the thermal network identification of electronic assemblies,
日本機械学会熱工学コンファレンス2023,
日本機械学会熱工学コンファレンス2023講演論文集,
C131,
Oct. 2023.
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中溝 裕紀,
J.V. Thomsen Silveira,
伏信 一慶,
篠田 卓也.
非定常熱流検出による電子部品の消費電力計測手法の提案 − 熱流センサによる非破壊高速検出手法,
第58回日本伝熱シンポジウム,
第58回日本伝熱シンポジウム講演論文集,
May 2021.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of electronic component by means of external heater and heat flux sensor,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D112,
May 2019.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D124,
May 2019.
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J.V. Thomsen Silveira,
B. Yang,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor,
日本機械学会熱工学コンファレンス2016,
日本機械学会熱工学コンファレンス2018講演論文集,
Oct. 2018.
学位論文
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Characterization of thermal parameters of electronic assemblies by means of in situ measurements,
Thesis,
Doctor (Engineering),
Tokyo Institute of Technology,
2023/09/22,
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Characterization of thermal parameters of electronic assemblies by means of in situ measurements,
Exam Summary,
Doctor (Engineering),
Tokyo Institute of Technology,
2023/09/22,
-
Characterization of thermal parameters of electronic assemblies by means of in situ measurements,
Summary,
Doctor (Engineering),
Tokyo Institute of Technology,
2023/09/22,
-
Characterization of thermal parameters of electronic assemblies by means of in situ measurements,
Outline,
Doctor (Engineering),
Tokyo Institute of Technology,
2023/09/22,
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