@inproceedings{CTT100875336,
  author = {S. Kawakita and Y. Ishizaka and K. Fushinobu},
  title = {A Thermal Conductivity Prediction Model for Composite Thermal Interface Materials using Copper Metal Foam},
  booktitle = {Proc. ASME InterPACK 2021},
  year = 2021,
}

@inproceedings{CTT100851442,
  author = {S. Kawakita and Y. Ishizaka and M. Teranishi and K. Fushinobu},
  title = {Comparison between the theoretical, experimental and numerical of thermal conductivity of composite thermal interface  materials using copper metal foam},
  booktitle = {Proc. ITherm 2020 Virtual},
  year = 2020,
}

@inproceedings{CTT100816045,
  author = {S. Kawakita and Y. Ishizaka and K. Fushinobu},
  title = {Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816024,
  author = {石坂 祐樹 and 寺西 美波 and 伏信 一慶 and 河喜多 心哉},
  title = {オープンセル型銅フォームを用いた車載電子機器用複合放熱部材の熱伝導率評価},
  booktitle = {日本機械学会熱工学コンファレンス2019講演論文集},
  year = 2019,
}