論文

• Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Seno, Kazuhiro Takahashi. Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes, Key Engineering Materials, Vol. 462-463, pp. 807-811, Jan. 2011.
• Naoya SAIKI, Kazuaki INABA, Kikuo KISHIMOTO, Hideo SENO, Kazuyoshi EBE. Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes, Journal of Solid Mechanics and Materials Engineering, 日本機械学会, Vol. 4, No. 7, pp. 1051-1060, July 2010.
• 佐伯尚哉, 市川功, 因幡和晃, 岸本喜久雄. 粘接着テープを用いた半導体製造工程におけるピックアップ性能評価, 日本機械学会論文集（A編）, 日本機械学会, 76, 766, 730-736, June 2010.

国際会議発表 (査読有り)

• Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, H. Senoo. Evaluation of reliability of film adhesives in semiconductor packages, Pacific rim technical conference and exhibition on packaging and integration of electronic and photonic systems (Interpack 2011), Proceedings of Interpack 2011, July 2011.
• Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, H. Senoo. Modeling and validation of evaluation method on IC chip pick-up performance, The electronics system integration technology conference (ESTC 2010), Proceedings of ESTC 2010, Sept. 2010.

国際会議発表 (査読なし・不明)

• KIKUO KISHIMOTO, naoya saiki, Kazuaki Inaba. Peering Strength of Adhesive Films for Semiconductor Packages, Joint Symposium on Mechanics of Advanced Materials & Structures 2011, Joint Symposium on Mechanics of Advanced Materials & Structures 2011, Xi'an Jiaotong University, p. 3, Aug. 2011.
• Naoya SAIKI, Kazuaki INABA, K. Kishimoto. STUDY ON PEELING BEHAVIOR OF ADHESIVE FILMS FOR SEMICONDUCTOR PACKAGES, Asian Pacific Conference for Materials and Mechanics 2009, Proceedings of Asian Pacific Conference for Materials and Mechanics 2009, JSME, pp. 1-4, Nov. 2009.

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