@book{CTT100683461,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang},
  title = {Chaper 9: Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte},
  publisher = {INTECH},
  year = 2015,
}

@article{CTT100634498,
  author = {Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles},
  journal = {Surface & Coating Technology},
  year = 2013,
}

@article{CTT100633640,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles},
  journal = {Thin Solid Films},
  year = 2013,
}

@article{CTT100633995,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles},
  journal = {Microelectronic Engineering},
  year = 2012,
}

@inproceedings{CTT100702796,
  author = {Masato Sone and Tso-Fu Mark Chang and Tetsuya Shimizu and Nao Shinoda},
  title = {Nanoscale Wiring by Cu Electrodeposition in Supercritical CO2 Emulsified Electrolyte with Continuous-Flow Reaction System (Invited Lecture)},
  booktitle = {Separation Techniques 2016},
  year = 2016,
}

@inproceedings{CTT100701914,
  author = {Masato Sone and Tso-Fu Mark Chang and Tetsuya Shimizu and Nao Shinoda},
  title = {Nanoscale Wiring by Cu Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture)},
  booktitle = {CC3DMR},
  year = 2016,
}

@inproceedings{CTT100673133,
  author = {Tso-Fu Mark Chang and Wei-Hao Lin and Takashi Nagoshi and Nao Shinoda and Yung-Jung Hsu and Tatsuo Sato and Masato Sone},
  title = {Metals and Metal Oxides Electrodeposited with Supercritical Carbon Dioxide Emulsified Electrolyte},
  booktitle = {},
  year = 2014,
}

@inproceedings{CTT100665562,
  author = {Masato Sone and Tetsuya Shimizu and Tso-Fu Mark Chang and Nao Shinoda and Takashi Nagoshi and Tatsuo Sato},
  title = {Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture)},
  booktitle = {IUMRS-ICEM 2014},
  year = 2014,
}

@inproceedings{CTT100659620,
  author = {Tso-Fu Mark Chang and Takashi Nagoshi and Nao Shinoda and HIkaru Kinashi and Tatsuo Sato and Masato Sone},
  title = {Application of Supercritical CO2 in Electroplating of Ni and Cu},
  booktitle = {SuperGreen 2013,The 8th International Conference on Supercritical Fluids},
  year = 2013,
}

@inproceedings{CTT100642334,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang},
  title = {Application of Electrodeposition using Supercritical Carbon Dioxide Emulsion into Integrated Circuit Technology (Invited Lecture)},
  booktitle = {TSCFA2012},
  year = 2012,
}

@inproceedings{CTT100626020,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Novel Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles},
  booktitle = {TACT2011,International Thin Film Conference},
  year = 2011,
}

@inproceedings{CTT100626019,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang and Akinobu Shibata},
  title = {Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles (Invited Lecture)},
  booktitle = {TACT2011,International Thin Film Conference},
  year = 2011,
}

@inproceedings{CTT100630169,
  author = {Nao Shinoda and Tetuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles},
  booktitle = {Taiwan Supercritical Fluid Association (TSCFA)},
  year = 2011,
}

@inproceedings{CTT100625613,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles},
  booktitle = {},
  year = 2011,
}