@inproceedings{CTT100570709,
  author = {Hideki Hatakeyama and Yusuke Uemichi and Kazuma Ohashi and Satoshi Fukuda and Hiroyuki Ito and Kenichi Okada and Tatsuya Ito and Kazuya Masu},
  title = {RF CMOS Circuits with Wafer-Level Packaging Inductors},
  booktitle = {International Wafer-Level Packaging Conference},
  year = 2008,
}

@inproceedings{CTT100570714,
  author = {Susumu Sadoshima and Satoshi Fukuda and Hiroyuki Ito and Kenichi Okada and Hideki Hatakeyama and Naoyuki Ozawa and Masakazu Sato and Tatsuya Ito and Kazuya Masu},
  title = {A 2-GHz-band CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Package},
  booktitle = {International Conference on Solid State Devices and Materials (SSDM)},
  year = 2008,
}

@inproceedings{CTT100570717,
  author = {Kazuma Ohashi and Yuka Kobayashi and Hiroyuki Ito and Kenichi Okada and Hideki Hatakeyama and Takuya Aizawa and Tatsuya Ito and Ryozo Yamauchi and Kazuya Masu},
  title = {A Low Phase Noise LC-VCO with a High-Q Inductor Fabricated by Wafer Level Package Technology},
  booktitle = {Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008)},
  year = 2008,
}

@inproceedings{CTT100585348,
  author = {Tomoaki Maekawa and Takahiro Ishii and Junki Seita and Hiroyuki Ito and Kenichi Okada and Hideki Hatakeyama and Y.Uemichi and Tatsuya Ito and Ryozo Yamauchi and Kazuya Masu},
  title = {A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology},
  booktitle = {IEEE Workshop on Signal Propagation on Interconnects (SPI)},
  year = 2008,
}

@inproceedings{CTT100556009,
  author = {Kazuhisa Itoi and Masakazu Sato and Hiroshi Abe and Takuya Aizawa and Oasmu Nakao and Takashi Takizawa and Kenichi Okada and Kazuya Masu and Tatsuya Ito},
  title = {Fabrication of high-performance on-die passives based on multi-Cu-layer WLP processes},
  booktitle = {},
  year = 2005,
}

@inproceedings{CTT100589441,
  author = {Tatsuya Ito and Kazuhisa Itoi and Masakazu Sato and Hiroshi Abe and Kenichi Okada and Kazuya Masu},
  title = {Integration of the passive element above IC wafers by applying Wafer Level Package technology},
  booktitle = {3rd International Workshop on High Frequency Micromagnetic Devices and Materials},
  year = 2005,
}

@inproceedings{CTT100589438,
  author = {Kazuhisa Itoi and Masakazu Sato and Kenichi Okada and Kazuya Masu and Tatsuya Ito},
  title = {Comparison of compact on-chip inductors embedded in Wafer-level Package},
  booktitle = {2005 Electronic Components and Technology Conference},
  year = 2005,
}

@inproceedings{CTT100589443,
  author = {Kazuhisa Itoi and Masakazu Sato and Hiroshi Abe and Hirotaka Sugawara and Hiroyuki Ito and Kenichi Okada and Kazuya Masu and Tatsuya Ito},
  title = {On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application},
  booktitle = {IEEE MTT-S International Microwave Symposium},
  year = 2004,
}