国際会議発表 (査読有り)

• Hideki Hatakeyama, Yusuke Uemichi, Kazuma Ohashi, Satoshi Fukuda, Hiroyuki Ito, Kenichi Okada, Tatsuya Ito, Kazuya Masu. RF CMOS Circuits with Wafer-Level Packaging Inductors, International Wafer-Level Packaging Conference, International Wafer-Level Packaging Conference, pp. 69-73, Oct. 2008.
• Susumu Sadoshima, Satoshi Fukuda, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Naoyuki Ozawa, Masakazu Sato, Tatsuya Ito, Kazuya Masu. A 2-GHz-band CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Package, International Conference on Solid State Devices and Materials (SSDM), International Conference on Solid State Devices and Materials (SSDM), D-1-3, pp. 74-75, Sept. 2008.
• Kazuma Ohashi, Yuka Kobayashi, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Takuya Aizawa, Tatsuya Ito, Ryozo Yamauchi, Kazuya Masu. A Low Phase Noise LC-VCO with a High-Q Inductor Fabricated by Wafer Level Package Technology, Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008), Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008), pp. 123-126, June 2008.
• Tomoaki Maekawa, Takahiro Ishii, Junki Seita, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Y.Uemichi, Tatsuya Ito, Ryozo Yamauchi, Kazuya Masu. A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology, IEEE Workshop on Signal Propagation on Interconnects (SPI), IEEE Workshop on Signal Propagation on Interconnects (SPI), May 2008.
• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Takuya Aizawa, Oasmu Nakao, Takashi Takizawa, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Fabrication of high-performance on-die passives based on multi-Cu-layer WLP processes, International Wafer-Level Packaging Congress, Nov. 2005.
• Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Kenichi Okada, Kazuya Masu. Integration of the passive element above IC wafers by applying Wafer Level Package technology, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, pp. 29-30, Apr. 2005.
• Kazuhisa Itoi, Masakazu Sato, Kenichi Okada, Kazuya Masu, Tatsuya Ito. Comparison of compact on-chip inductors embedded in Wafer-level Package, 2005 Electronic Components and Technology Conference, 2005 Electronic Components and Technology Conference, Electronic Components and Technology Conference, Vol. 2, pp. 1578-1583, 2005.
• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Hirotaka Sugawara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu, Tatsuya Ito. On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application, IEEE MTT-S International Microwave Symposium, IEEE MTT-S International Microwave Symposium, Vol. 1, pp. 197-200, June 2004.

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