国際会議発表 (査読有り)

• Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Kenichi Okada, Kazuya Masu. Integration of the passive element above IC wafers by applying Wafer Level Package technology, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, 3rd International Workshop on High Frequency Micromagnetic Devices and Materials, pp. 29-30, Apr. 2005.
• Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Hirotaka Sugawara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu, Tatsuya Ito. On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application, IEEE MTT-S International Microwave Symposium, IEEE MTT-S International Microwave Symposium, Vol. 1, pp. 197-200, June 2004.

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