@article{CTT100828202,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2020,
}

@article{CTT100821117,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2019,
}