論文

• Takehiko Kikuchi, Liu Bai, Takuya Mitarai, Hideki Yagi, Masato Furukawa, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai. Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer, Japanese Journal of Applied Physics, Vol. 59, p. SBBD02, May 2020.
• Takehiko Kikuchi, Liu Bai, Takuya Mitarai, Hideki Yagi, Masato Furukawa, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai. Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer, Japanese Journal of Applied Physics, Volume 59, Number SB, pp. SBBD02-1, Dec. 2019.

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