@article{CTT100893469,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2023,
}

@article{CTT100875342,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2022,
}

@article{CTT100875335,
  author = {Z. Li and H. Haketa and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement},
  journal = {Microelectronics Reliability},
  year = 2021,
}

@article{CTT100875337,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor},
  journal = {Transactions of The Japan Institute of Electronics Packaging},
  year = 2021,
}

@inproceedings{CTT100816025,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816026,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Transient thermal response investigation of multiple heat-source electronic systems},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100815571,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component by means of external heater and heat flux sensor},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100815570,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100815569,
  author = {J.V. Thomsen Silveira and Z. Li and B. Yang and R. Yasui and T. Shinoda and K. Fushinobu},
  title = {Analysis of heat transfer from a heat dissipating device on a substrate},
  booktitle = {Proc. ITherm2019},
  year = 2019,
}

@inproceedings{CTT100789786,
  author = {J.V. Thomsen Silveira and B. Yang and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor},
  booktitle = {日本機械学会熱工学コンファレンス2018講演論文集},
  year = 2018,
}

@inproceedings{CTT100771151,
  author = {Hiroyuki Haketa and Zi Di Li and KAZUYOSHI FUSHINOBU and 安井 竜太 and Takuya Shinoda},
  title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement},
  booktitle = {第55回日本伝熱シンポジウム講演論文集},
  year = 2018,
}

@misc{CTT100892001,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  year = 2021,
}

@misc{CTT100892000,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  year = 2021,
}

@misc{CTT100891999,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  year = 2021,
}

@misc{CTT100891998,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  year = 2021,
}



@phdthesis{CTT100892001,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  school = {東京工業大学},
  year = 2021,
}

@phdthesis{CTT100892000,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  school = {東京工業大学},
  year = 2021,
}

@phdthesis{CTT100891999,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  school = {東京工業大学},
  year = 2021,
}

@phdthesis{CTT100891998,
  author = {Zi Di Li},
  title = {Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs},
  school = {東京工業大学},
  year = 2021,
}