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LIZI DI 研究業績一覧 (15件)
論文
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 13,
No. 3,
pp. 315-322,
2023.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards,
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 12,
No. 2,
pp. 280,
2022.
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Z. Li,
H. Haketa,
K. Fushinobu,
R. Yasui,
T. Shinoda.
In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement,
Microelectronics Reliability,
Vol. 123,
2021.
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
H. Nakamizo,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor,
Transactions of The Japan Institute of Electronics Packaging,
Vol. 14,
pp. E21-003-1,
2021.
国際会議発表 (査読有り)
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor,
ISTP30,
Proc. ISTP30,
No. ISTP134,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Transient thermal response investigation of multiple heat-source electronic systems,
ISTP30,
Proc. ISTP30,
No. ISTP212,
Nov. 2019.
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J.V. Thomsen Silveira,
Z. Li,
B. Yang,
R. Yasui,
T. Shinoda,
K. Fushinobu.
Analysis of heat transfer from a heat dissipating device on a substrate,
ITherm 2019,
Proc. ITherm2019,
No. 400,
May 2019.
国内会議発表 (査読なし・不明)
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Z. Li,
J.V. Thomsen Silveira,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement of electronic component by means of external heater and heat flux sensor,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D112,
May 2019.
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J.V. Thomsen Silveira,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver,
第56回日本伝熱シンポジウム,
第56回日本伝熱シンポジウム講演論文集,
No. D124,
May 2019.
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J.V. Thomsen Silveira,
B. Yang,
Z. Li,
K. Fushinobu,
R. Yasui,
T. Shinoda.
Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor,
日本機械学会熱工学コンファレンス2016,
日本機械学会熱工学コンファレンス2018講演論文集,
Oct. 2018.
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Hiroyuki Haketa,
Zi Di Li,
KAZUYOSHI FUSHINOBU,
安井 竜太,
Takuya Shinoda.
In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement,
第55回日本伝熱シンポジウム,
第55回日本伝熱シンポジウム講演論文集,
May 2018.
学位論文
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Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs,
Exam Summary,
Doctor (Engineering),
Tokyo Institute of Technology,
2021/12/31,
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Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs,
Outline,
Doctor (Engineering),
Tokyo Institute of Technology,
2021/12/31,
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Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs,
Summary,
Doctor (Engineering),
Tokyo Institute of Technology,
2021/12/31,
-
Thermal metrology for the reliability challenges of electronic components on next generation high power dissipating ECUs,
Thesis,
Doctor (Engineering),
Tokyo Institute of Technology,
2021/12/31,
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