論文

• Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles, Surface & Coating Technology, Elsevier, Vol. 231, pp. 77-80, Aug. 2013.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles, Thin Solid Films, Elsevier, Vol. 529, pp. 29-33, Jan. 2013.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles, Microelectronic Engineering, Elsevier, Vol. 97C, pp. 126-129, Aug. 2012.

著書

• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang. Chaper 9: Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte, Electroplating of Nanostructure, INTECH, pp. 189-210, Dec. 2015.

国際会議発表 (査読有り)

• Masato Sone, Tso-Fu Mark Chang, Tetsuya Shimizu, Nao Shinoda. Nanoscale Wiring by Cu Electrodeposition in Supercritical CO2 Emulsified Electrolyte with Continuous-Flow Reaction System (Invited Lecture), Separation Techniques 2016,2nd International Conference and Expo on Separation Techniques, Separation Techniques 2016, Sept. 2016.
• Masato Sone, Tso-Fu Mark Chang, Tetsuya Shimizu, Nao Shinoda. Nanoscale Wiring by Cu Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture), 216 Collaborative Conference on 3D and Materials Research (CC3DMR), CC3DMR, June 2016.
• Tso-Fu Mark Chang, Wei-Hao Lin, Takashi Nagoshi, Nao Shinoda, Yung-Jung Hsu, Tatsuo Sato, Masato Sone. Metals and Metal Oxides Electrodeposited with Supercritical Carbon Dioxide Emulsified Electrolyte, 65th Annual Meeting of the International Society of Electrochemistry, Aug. 2014.
• Masato Sone, Tetsuya Shimizu, Tso-Fu Mark Chang, Nao Shinoda, Takashi Nagoshi, Tatsuo Sato. Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture), IUMRS-ICEM 2014, International Union of Materials Research Societies - International Conference on Electronic Materials, IUMRS-ICEM 2014, June 2014.
• Tso-Fu Mark Chang, Takashi Nagoshi, Nao Shinoda, HIkaru Kinashi, Tatsuo Sato, Masato Sone. Application of Supercritical CO2 in Electroplating of Ni and Cu, SuperGreen 2013,The 8th International Conference on Supercritical Fluids, SuperGreen 2013,The 8th International Conference on Supercritical Fluids, Oct. 2013.
• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang. Application of Electrodeposition using Supercritical Carbon Dioxide Emulsion into Integrated Circuit Technology (Invited Lecture), TSCFA2012, pp. in press, Oct. 2012.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Novel Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles, TACT2011,International Thin Film Conference, TACT2011,International Thin Film Conference, p. A20110519008, Nov. 2011.
• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang, Akinobu Shibata. Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles (Invited Lecture), TACT2011,International Thin Film Conference, TACT2011,International Thin Film Conference, p. 21, Nov. 2011.
• Nao Shinoda, Tetuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles, Taiwan Supercritical Fluid Association (TSCFA), Taiwan Supercritical Fluid Association (TSCFA), Taiwan Supercritical Fluid Association (TSCFA), p. 20, Oct. 2011.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles, 37th International Conference on Micro and Nano Engineering, (MNE2011), Elsevier, pp. in press, Sept. 2011.

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